TSMC's Cash Bonanza: NT$4 Dividend per Share for Q2!
Overview
- TSMC declares NT$4 cash dividend per share for Q2 2024.
- Ex-dividend date set for December 12, 2024, with payouts on January 9, 2025.
- Record net income of NT$247.85 billion showcases TSMC's financial strength.
Key Highlights of TSMC's Dividend Announcement
On August 13, 2024, the Taiwan Semiconductor Manufacturing Company (TSMC) reported a cash dividend distribution of NT$4 per share for Q2 2024, reflecting the company's remarkable profitability and commitment to shareholders. The ex-dividend date is established for December 12, 2024, meaning investors must own shares before this date to qualify for the dividend. Additionally, the record date is set for December 18, 2024, ensuring that only eligible shareholders will benefit from the payout. This announcement comes on the heels of a record net income of NT$247.85 billion for the quarter, marking the company's capacity to deliver consistent financial results and reinforcing its status as an industry leader.
Financial Performance and Market Position
TSMC's impressive Q2 financial performance underscores its dominance in the semiconductor sector. The company reported consolidated revenue of NT$673.51 billion, signifying a 13.6% increase from the previous quarter, a growth largely driven by high-performance computing (HPC) technology demands. TSMC also achieved a remarkable earnings per share (EPS) of NT$9.56, indicating robust profitability and operational efficiency. This strong financial outcome not only enhances shareholder confidence but also positions TSMC favorably against its competitors. Prominent figures, such as Chairman C.C. Wei, stand to earn substantial dividends, exemplifying the company's rewarding approach to its investors, particularly the National Development Fund, which will receive NT$6.61 billion from its shares.
Strategic Investments and Future Growth Initiatives
In addition to its dividend announcement, TSMC outlined ambitious plans for future growth with a capital appropriation of US$29.61 billion aimed at advancing technological capabilities and expanding manufacturing facilities. This funding will support the development of advanced packaging technologies and enhance TSMC’s competitive edge in response to market demands. Moreover, a targeted investment of up to US$7.5 billion for TSMC's Arizona operations signifies the company's commitment to bolstering its global operational capacity. These strategic investments not only promise sustainable growth and innovation but also reinforce TSMC's dedication to generating long-term value for its shareholders in the rapidly evolving semiconductor landscape.
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